| Moteur de recherche de fiches techniques de composants électroniques |
|
MPC860EC Fiches technique(PDF) 75 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC860EC Fiches technique(HTML) 75 Page - Freescale Semiconductor, Inc |
|
75 / 80 page ![]() MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8 Freescale Semiconductor 75 Mechanical Data and Ordering Information Figure 78 shows the mechanical dimensions of the ZQ PBGA package. Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package NOTE 1. All Dimensions in millimeters. 2. Dimensions and tolerance per ASME Y14.5M, 1994. 3. Maximum Solder Ball Diameter measured parallel to Datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |