ST7L09 datasheet(94/104 Pages) STMICROELECTRONICS

94 / 104 page

ST7L05, ST7L09

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14 PACKAGE CHARACTERISTICS

In order to meet environmental requirements, ST

offers these devices in ECOPACK® packages.

These packages have a lead-free second level in-

terconnect. The category of second Level Inter-

connect is marked on the package and on the in-

ner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to solder-

ing conditions are also marked on the inner box la-

bel.

ECOPACK is an ST trademark. ECOPACK speci-

fications are available at www.st.com.

14.1 PACKAGE MECHANICAL DATA

Figure 72. 16-Pin Plastic Small Outline Package, 150-mil Width

14.2 THERMAL CHARACTERISTICS

Notes:

1. The maximum chip-junction temperature is based on technology characteristics.

2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the

chip internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the application.

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to ambient)

°C/W

TJmax

Maximum junction temperature1)

150

°C

PDmax

Power dissipation2)

500

Dim.

inches

Min

Typ

Max

Min

Typ

Max

1.35

1.75 0.053

0.069

0.10

0.25 0.004

0.010

0.33

0.51 0.013

0.020

0.19

0.25 0.007

0.010

9.80

10.00 0.386

0.394

3.80

4.00 0.150

0.157

1.27

0.050

5.80

6.20 0.228

0.244

0°

8°

0°

8°

0.40

1.27 0.016

0.050

Number of Pins

0016020

45×

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