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LSF0102 Fiches technique(PDF) 41 Page - Texas Instruments |
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LSF0102 Fiches technique(HTML) 41 Page - Texas Instruments |
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41 / 42 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 8X (0.85) 8X (0.3) 6X (0.5) (3.1) (R0.05) TYP VSSOP - 0.9 mm max height DCU0008A SMALL OUTLINE PACKAGE 4225266/A 09/2014 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 25X SYMM SYMM 1 4 5 8 |
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