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LSF0102 Fiches technique(PDF) 40 Page - Texas Instruments |
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LSF0102 Fiches technique(HTML) 40 Page - Texas Instruments |
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40 / 42 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND 8X (0.85) 8X (0.3) 6X (0.5) (3.1) (R0.05) TYP VSSOP - 0.9 mm max height DCU0008A SMALL OUTLINE PACKAGE 4225266/A 09/2014 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 25X SYMM SYMM 1 4 5 8 SEE SOLDER MASK DETAILS 15.000 METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED |
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