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INA745AIRELR Fiches technique(PDF) 47 Page - Texas Instruments |
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INA745AIRELR Fiches technique(HTML) 47 Page - Texas Instruments |
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47 / 50 page ![]() www.ti.com PACKAGE OUTLINE 3.1 2.9 5.1 4.9 1.0 0.8 0.05 0.00 2X 3 10X 0.6 2X 1.5 12X 0.5 0.3 18X 0.35 0.25 2X 1.0 0.8 2X 0.55 0.45 4X 0.75 (0.2) TYP 4X (R0.2) VQFN - 1 mm max height REL0014B PLASTIC QUAD FLATPACK - NO LEAD 4228721/A 05/2022 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE SYMM SYMM 1 6 7 8 13 14 SCALE 3.000 A B C |
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