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INA745AIRELR Fiches technique(PDF) 40 Page - Texas Instruments |
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INA745AIRELR Fiches technique(HTML) 40 Page - Texas Instruments |
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40 / 50 page ![]() A A www.ti.com PACKAGE OUTLINE 3.1 2.9 5.1 4.9 1.0 0.8 0.05 0.00 2X 3 10X 0.6 2X 1.5 12X 0.5 0.3 18X 0.35 0.25 2X 1.0 0.8 2X 0.55 0.45 0.13 MIN 4X 0.75 (0.2) TYP (0.13) (0.19) TYP 4X (R0.2) VQFN - 1 mm max height REL0014A PLASTIC QUAD FLATPACK - NO LEAD 4228616/A 04/2022 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE SYMM SYMM 1 6 7 8 13 14 SCALE 3.000 A-A40.000 SECTION A-A TYPICAL A B C INA745A, INA745B SBOSAC3B – JULY 2023 – REVISED AUGUST 2025 www.ti.com 40 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: INA745A INA745B |
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