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PUSB3AB4 Fiches technique(PDF) 9 Page - Nexperia B.V. All rights reserved |
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PUSB3AB4 Fiches technique(HTML) 9 Page - Nexperia B.V. All rights reserved |
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9 / 13 page ![]() © Nexperia B.V. 2017. All rights reserved PUSB3AB4 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 2 — 4 May 2016 9 of 13 Nexperia PUSB3AB4 ESD protection for ultra high-speed interfaces 9. Soldering Fig 16. Reflow soldering footprint DFN2510A-10 (SOT1176-1) SOT1176-1 Remark: Stencil of 75 μm is recommended. A stencil of 75 μm gives an aspect ratio of 0.77 With a stencil of 100 μm one will obtain an aspect ratio of 0.58 Footprint information for reflow soldering of DFN2510A-10 package solder land plus solder paste occupied area solder land solder paste deposit solder resist Hx By Hy 0.05 C P D 0.05 Ay Dimensions in mm Ay By C D Hy 1.25 0.3 0.475 0.2 P 0.5 1.5 Hx 2.45 Generic footprint pattern Refer to the package outline drawing for actual layout sot1176-1_fr |
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