STPS2L25

Package information

7/9

Figure 17.

SMB Flat footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 5.

SMB Flat dimensions

Ref.

Dimensions

Millimeters

Inches

Min. Typ. Max.

Min.

Typ.

Max.

A

0.90

1.10

0.035

0.043

1.

Applies to plated leads

1.95

2.20

0.077

0.087

c(1)

0.15

0.40

0.006

0.016

D

3.30

3.95

0.130

0.156

E

5.10

5.60

0.200

0.220

E1

4.05

4.60

0.189

0.181

L

0.75

1.50

0.029

0.059

L1

0.40

0.016

L2

0.60

0.024

D

A

L

L

L1

L2

E E1

b

c

1.20

1.20

3.44

5.84

2.07