L6728 datasheet(30/32 Pages) STMICROELECTRONICS

30 / 32 page

Mechanical data and package dimensions

L6728

30/32

Mechanical data and package dimensions

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Figure 18.

Mechanical data and package dimensions

DIMENSIONS

REF.

inch

MIN.

TYP. MAX. MIN.

TYP.

MAX.

0.80

0.90

1.00

0.031

0.035

0.039

0.02

0.05

0.001

0.002

0.70

0.028

0.20

0.008

0.18

0.23

0.30

0.007

0.009

0.012

3.00

0.118

2.21

2.26

2.31

0.087

0.089

0.091

3.00

0.118

1.49

1.64

1.74

0.059

0.065

0.069

e0.50

0.20

0.3

0.4

0.5

0.012

0.016

0.020

PACKAGE AND

PACKING INFORMATION

DFN10 (3x3)

Weight: not available

DUAL FLAT NO-LEAD

PACKAGE

0.75

0.295

0.25

0.098

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