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PCA2129T/Q900/2 Fiches technique(PDF) 4 Page - NXP Semiconductors |
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PCA2129T/Q900/2 Fiches technique(HTML) 4 Page - NXP Semiconductors |
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4 / 84 page ![]() PCA2129 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 19 December 2014 4 of 84 NXP Semiconductors PCA2129 Automotive accurate RTC with integrated quartz crystal 7. Pinning information 7.1 Pinning After lead forming and cutting, there remain stubs from the package assembly process. These stubs are present at the edge of the package as illustrated in Figure 3. The stubs are at an electrical potential. To avoid malfunction of the PCA2129, it has to be ensured that they are not shorted with another electrical potential (e.g. by condensation). Top view. For mechanical details, see Figure 47. Fig 2. Pin configuration for PCA2129 (SO16) Fig 3. Position of the stubs from the package assembly process |
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