TPD7203F

2006-10-31

17

Usage Precautions

Note 1:

Feeding the charge pump voltage to external devices

Current can be taken out of the final stage (CPV pin) of the charge pump and fed to external devices

without causing any problem. In this case, because the charge pump voltage drops, increase the

capacitance of the capacitor connected to the CPV pin. However, this will cause the charging current to the

capacitor and, hence, loss in the IC to increase. Therefore be careful not to exceed the allowable loss.

Note 2:

Heat sink design

Because this IC contains a charge pump function, loss in it affects external capacitor capacitance and

diode characteristics. It is recommended that the junction temperature, Tj, be judged from the on-voltage of

Note 3:

Dead time setting

For arm-shorting input logic, all outputs (UU, VU, WU, UB, VB and WB) are pulled low. When

operating in forward or reverse mode, take into account the IC output switching time and the switching time

(including temperature characteristic) of the external power MOSFET when setting the dead time. The dead

time required for only the IC, not including the external power MOSFET, is 4

μs (within all operating power

supply voltages and all operating temperatures).

Note 4:

GND lines.

Note 5:

Precautions on dry packing

After unpacking dry or moisture-proof packing, make sure the device is mounted in place within 48

hours at a temperature and humidity of 30°C and 60% RH or less. Because the device is emboss-taped

and cannot be processed by baking, always be sure to use it within the said allowable time after unpacking.

Standard tape packing quantity: 2000 devices / reel (EL1).