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SC16C852LIB Fiches technique(PDF) 57 Page - NXP Semiconductors |
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SC16C852LIB Fiches technique(HTML) 57 Page - NXP Semiconductors |
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57 / 60 page ![]() SC16C852L_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 25 January 2007 57 of 60 NXP Semiconductors SC16C852L 1.8 V dual UART with 128-byte FIFOs and IrDA encoder/decoder For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 13. Abbreviations MSL: Moisture Sensitivity Level Fig 32. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 43. Abbreviations Acronym Description CPU Central Processing Unit DLL Divisor Latch LSB DLM Divisor Latch MSB DMA Direct Memory Access FIFO First In, First Out IrDA Infrared Data Association ISDN Integrated Service Digital Network LSB Least Significant Bit MSB Most Significant Bit PCB Printed-Circuit Board RoHS Restriction of Hazardous Substances directive UART Universal Asynchronous Receiver/Transmitter |
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