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SAM9X75 Fiches technique(PDF) 27 Page - Microchip Technology |
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SAM9X75 Fiches technique(HTML) 27 Page - Microchip Technology |
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27 / 36 page ![]() SAM9X75 SiP Mechanical Characteristics Data Sheet © 2023 Microchip Technology Inc. and its subsidiaries DS60001827B - 27 RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.80 BSC MIN E MAX 12.80 BSC Contact Pad Width (X243) X 0.35 NOM C1 Contact Pad Spacing 12.80 BSC Contact Pad to Contact Pad G 0.45 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2022 Microchip Technology Inc. Microchip Technology Drawing C04-23556 Rev B C1 C2 E ØX G SILK SCREEN A B C D E F G H J K L M N P R T U 1 2345 6789 10 11 12 13 14 15 16 17 243-Ball Thin Fine-Pitch Ball Grid Array (4TB) - 16x16x1.23 mm Body [TFBGA] |
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