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TUSB2E221 Fiches technique(PDF) 56 Page - Texas Instruments |
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TUSB2E221 Fiches technique(HTML) 56 Page - Texas Instruments |
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56 / 65 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.0325 MIN 0.0325 MAX 25X ( 0.2) (0.35) TYP (0.35) TYP ( 0.2) SOLDER MASK OPENING ( 0.2) METAL 4224054/A 11/2017 DSBGA - 0.5 mm max height YCG0025 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 3 4 5 A B D E EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 40X NON-SOLDER MASK DEFINED EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK EXPOSED METAL TUSB2E221 SNLS757B – JUNE 2024 – REVISED NOVEMBER 2024 www.ti.com 56 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TUSB2E221 |
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