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TUSB2E221 Fiches technique(PDF) 55 Page - Texas Instruments |
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TUSB2E221 Fiches technique(HTML) 55 Page - Texas Instruments |
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55 / 65 page ![]() www.ti.com PACKAGE OUTLINE C 0.5 MAX 0.16 0.10 1.4 TYP 1.4 TYP 0.35 TYP 0.35 TYP 25X 0.225 0.185 B E A D 4224054/A 11/2017 DSBGA - 0.5 mm max height YCG0025 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 1 2 3 0.015 C A B 4 5 SYMM SYMM B C D E SCALE 8.000 D: Max = 2.02 mm, Min = 1.98 mm E: Max = 2.02 mm, Min = 1.98 mm www.ti.com TUSB2E221 SNLS757B – JUNE 2024 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 55 Product Folder Links: TUSB2E221 |
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