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SSO-CLD-R1 Fiches technique(PDF) 5 Page - DOMINANT Semiconductors |
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SSO-CLD-R1 Fiches technique(HTML) 5 Page - DOMINANT Semiconductors |
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5 / 9 page ![]() DOMINANT Semiconductors 19/05/05 S SpiceLED AlInGaP SSx-CLD-v3 Page 5 of 5 Recommended Solder Pad Note: Component is based on a new package platform, which features “Bottom Only Terminations”. Solder joints are only formed at the bottom of the component and solder fillet will not be observable as the sides of the component are not solderable. Surfaces are not intended for soldering. |
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