MCP3909

DS22025A-page 34

© 2006 Microchip Technology Inc.

24-Lead Plastic Shrink Small Outline (SS) (SSOP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

2

1

D

p

n

B

E1

E

L

c

φ

A2

A1

A

NOM

INCHES

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed.010" (0.254mm) per side.

Overall Length

Overall Width

Overall Height

Number of Pins

Lead Width

Foot Angle

Lead Thickness

Foot Length

Molded Package Width

Molded Package Thickness

JEDEC Equivalent: MO-150

Drawing No. C04-132

* Controlling Parameter

Notes:

Standoff

Pitch

φ

B

c

L

0°

.010

.004

.025

Units

Dimension Limits

MIN

A

E

E1

D

A2

A1

n

p

.068

.318

.205

.301

.002

.066

MILLIMETERS*

–

4°

.006

.030

.015

.037

8°

–

0.25

0.09

0.63

0°

0.15

0.75

4°

–

.073

.068

.323

.209

.307

.005

.026 BSC.

24

.078

.070

.008

.328

.212

.311

MAX

1.73

8.07

5.20

7.65

0.05

1.68

MIN

1.86

0.13

8.20

5.30

7.80

1.73

0.65 BSC.

NOM

24

8°

0.38

–

0.95

1.78

1.99

0.21

8.33

5.38

7.90

MAX

Revised 9-14-05

See ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.