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TC9401 Fiches technique(PDF) 19 Page - Microchip Technology |
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TC9401 Fiches technique(HTML) 19 Page - Microchip Technology |
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19 / 24 page ![]() © 2006 Microchip Technology Inc. DS21483C-page 19 TC9400/9401/9402 9.0 PACKAGE INFORMATION 9.1 Package Marking Information Package marking data is not available at this time. 9.2 Taping Form 9.3 Package Dimensions Pin 1 Component Taping Orientation for 14-Pin SOIC (Narrow) Devices User Direction of Feed Standard Reel Component Orientation for 713 Suffix Device W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 14-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Reel Size, and Number of Components Per Reel .780 (19.81) .740 (18.80) .300 (7.62) .230 (5.84) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18) .110 (2.79) .090 (2.29) .065 (1.65) .045 (1.14) .020 (0.51) .016 (0.41) .040 (1.02) .020 (0.51) .098 (2.49) Max. .030 (0.76) Min. 14-Pin CDIP (Narrow) .400 (10.16) .320 (8.13) .015 (0.38) .008 (0.20) 3° Min. Pin 1 .320 (8.13) .290 (7.37) .150 (3.81) Min. Dimensions: inches (mm) |
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