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TDA8552T Fiches technique(PDF) 21 Page - NXP Semiconductors |
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TDA8552T Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 28 page ![]() 1998 Jun 02 21 Philips Semiconductors Preliminary specification 2 × 1.4 W BTL audio amplifiers with digital volume control and headphone sensing TDA8552T; TDA8552TS PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT163-1 10 20 w M b p detail X Z e 11 1 D y 0.25 075E04 MS-013AC pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale X θ A A1 A2 HE L p Q E c L v M A (A ) 3 A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 95-01-24 97-05-22 |
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