LT1010CDD datasheet(3/20 Pages) LINER

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LT1010

1010fc

SYMBOL

PARAMETER

CONDITIONS (Note 4)

MIN

TYP

MAX

UNITS

VSOS+

Positive Saturation Offset

IOUT = 0 (Note 5)

1.0

●

1.1

VSOS–

Negative Saturation Offset

IOUT = 0 (Note 5)

0.2

●

0.3

RSAT

Saturation Resistance

IOUT = ±150mA (Note 5)

Ω

●

Ω

VBIAS

Bias Terminal Voltage

RBIAS = 20Ω (Note 6)

700

840

●

560

880

Supply Current

IOUT = 0, IBIAS = 0

●

ELECTRICAL CHARACTERISTICS The ● indicates specifications which apply over the full operating

temperature range, otherwise specifications are at TA = 25°C. (See Note 4. Typical values in curves.)

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: For case temperatures above 25

°C, dissipation must be derated

based on a thermal resistance of 25

°C/W for the T package, 130°C/W for

the N8 package and 40

°C/W for the DD package for ambient temperatures

above 25

°C. See Applications Information.

Note 3: In current limit or thermal limit, input current increases sharply

with input-output differentials greater than 8V; so input current must be

limited. Input current also rises rapidly for input voltages 8V above V + or

0.5V below V –.

Note 4: Specifications apply for 4.5V

≤ VS ≤ 40V,

V – + 0.5V

≤ VIN ≤ V+ – 1.5V and IOUT = 0, unless otherwise stated.

Temperature range is 0

°C ≤ TJ ≤ 100°C, TC ≤ 100°C.

Note 5: The output saturation characteristics are measured with 100mV

output clipping. See Applications Information for determining available

output swing and input drive requirements for a given load.

Note 6: The output stage quiescent current can be increased by

connecting a resistor between the BIAS pin and V+. The increase is

equal to the bias terminal voltage divided by this resistance.

Note 7: Thermal resistance varies depending upon the amount of PC board

metal attached to the pin (Pin 9) of the device.

θJA is specified for a certain

amount of 1oz copper metal trace connecting to Pin 9 as described in the

thermal resistance tables in the Applications Information section.

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