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MSP430F14X Fiches technique(PDF) 76 Page - Texas Instruments |
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MSP430F14X Fiches technique(HTML) 76 Page - Texas Instruments |
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76 / 83 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND 64X (1.5) 64X (0.3) (11.4) (11.4) 60X (0.5) (R0.05) TYP LQFP - 1.6 mm max height PM0064A PLASTIC QUAD FLATPACK 4215162/A 03/2017 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 7. For more information, see Texas Instruments literature number SLMA004 (www.ti.com/lit/slma004). LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM SYMM 64 49 17 32 33 48 1 16 METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL |
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