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BZA109 Fiches technique(PDF) 8 Page - NXP Semiconductors |
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BZA109 Fiches technique(HTML) 8 Page - NXP Semiconductors |
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8 / 12 page ![]() 1997 Dec 01 8 Philips Semiconductors Product specification 9-fold ESD transient voltage suppressor BZA109 PACKAGE OUTLINE UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT163-1 10 20 w M b p detail X Z e 11 1 D y 0.25 075E04 MS-013AC pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale X θ A A1 A2 HE L p Q E c L v M A (A ) 3 A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 95-01-24 97-05-22 |
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