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PUSB3AB2DF Fiches technique(PDF) 8 Page - Nexperia B.V. All rights reserved

No de pièce PUSB3AB2DF
Description  Extremely low clamping low capacitance ESD protection
PDF  11 Pages
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Fabricant  NEXPERIA [Nexperia B.V. All rights reserved]
Site Internet  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

PUSB3AB2DF Fiches technique(HTML) 8 Page - Nexperia B.V. All rights reserved

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Nexperia
PUSB3AB2DF
Extremely low clamping low capacitance ESD protection
12. Soldering
SOT8013
Footprint information for reflow soldering of ultra small and leadless encapsulated package; 3 terminals
sot8013_fr
Issue date 19-10-29
occupied area
solder land
(Cu extends under
solder resist)
solder resist
stencil opening
Dimensions in mm
0.85
0.33 0.48
0.68
0.145
0.12
0.12
0.12
0.15
0.15
0.145
0.135
0.135
0.1
0.95
recommended stencil thickness: 0.08 mm
R 0.03
Fig. 12. Reflow soldering footprint for DFN0603-3 (SOT8013)
PUSB3AB2DF
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Product data sheet
22 November 2019
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