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TS922 Fiches technique(PDF) 15 Page - STMicroelectronics |
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TS922 Fiches technique(HTML) 15 Page - STMicroelectronics |
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15 / 21 page ![]() TS922 Package mechanical data 15/21 Figure 16. Flip-chip marking (top view) Note: Device orientation: the devices are oriented in the carrier pocket with bump number A1 adjacent to the sprocket holes. n Logo: ST n Part Number: 922 n Date Code: YWW n The dot is for marking the bump 1A corner 922 YWW BUMP 1A CORNER E LEADFREE 922 YWW BUMP 1A CORNER E LEADFREE A 1 A 1 User direction of feed A 1 A 1 User direction of feed |
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