USB2507 datasheet(44/44 Pages) SMSC

44 / 44 page

Integrated USB 2.0 Compatible 7-Port Hub

Datasheet

Revision 2.1 (12-06-06)

SMSC USB2507

DATASHEET

Chapter 9 Package Outline

Figure 9.1 80 Pin TQFP Package Outline (12x12x1.4 mm body - 2 mm footprint)

Notes:

1. Controlling Unit: millimeter.

2. Tolerance on the true position of the leads is ± 0.04 mm maximum.

3. Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

Table 9.1 80 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARKS

1.40

1.60

Overall Package Height

0.05

0.15

Standoff

1.35

1.40

1.45

Body Thickness

13.80

14.00

14.20

X Span

11.80

12.00

12.20

X body Size

13.80

14.00

14.20

Y Span

11.80

12.00

12.20

Y body Size

0.09

0.20

Lead Frame Thickness

0.45

0.60

0.75

Lead Foot Length

1.00 REF.

Lead Length

0.50 Basic

Lead Pitch

q0o

~7o

Lead Foot Angle

0.17

0.18

0.27

Lead Width

ccc

0.08

Coplanarity

USB2507 Fiches technique(PDF) 44 Page - SMSC Corporation

USB2507 Fiches technique(HTML) 44 Page - SMSC Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

Fiches technique Télécharger

Lien URL