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UPD6P4BGS Fiches technique(PDF) 6 Page - Renesas Technology Corp

No de pièce UPD6P4BGS
Description  MOS INTEGRATED CIRCUIT
PDF  34 Pages
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Fabricant  RENESAS [Renesas Technology Corp]
Site Internet  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPD6P4BGS Fiches technique(HTML) 6 Page - Renesas Technology Corp

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4
µPD6P4B
Data Sheet U13594EJ2V1DS00
LIST OF FUNCTIONS
Item
µPD6P4B
ROM capacity
1002
× 10 bits
One-time PROM
RAM capacity
32
× 4 bits
Stack
1 level (shared with RF of RAM)
I/O pin
Key input (KI)
: 4 pins
Key I/O (KI/O)
: 8 pins
Key expansion input (S0, S1)
: 2 pins
Remote control transmitter display output (LED)
: 1 pin (shared with S1 pin)
Number of keys
32 keys
48 keys (when expanded by key expansion input)
96 keys (when expanded by key expansion input and diode)
Clock frequency
Ceramic oscillation
fX = 2.4 to 4 MHz
fX = 4 to 8 MHzNote
Instruction execution time
16
µs (at fX = 4 MHz)
Carrier frequency
fX/8, fX/16, fX/64, fX/96, fX/128, fX/192, no carrier (high level)
Timer
9-bit programmable timer
: 1 channel
POC circuit
Provided
Supply voltage
VDD = 2.2 to 3.6 V (fX = 2.4 to 4 MHz), VDD = 2.7 to 3.6 V (fX = 4 to 8 MHz)
Operating ambient
• TA = –40 to +85
°C
temperature
• TA = –20 to +70
°C (when using POC circuit)
Package
• 20-pin plastic SOP (7.62 mm (300))
• 20-pin plastic SSOP (7.62 mm (300))
Note It is necessary to design the application circuit so that the RESET pin goes low at a supply voltage of less
than 2.7 V.



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