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HC705MC4GRS/D Fiches technique(PDF) 176 Page - NXP Semiconductors

No de pièce HC705MC4GRS/D
Description  General Release Specification
PDF  180 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

HC705MC4GRS/D Fiches technique(HTML) 176 Page - NXP Semiconductors

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Mechanical Specifications
MC68HC705MC4 — Rev. 2.0
Mechanical Specifications
15.3 Plastic Dual In-Line Package (Case 710)
15.4 Small Outline Integrated Circuit (Case 751F)
0.100 BSC
0.600 BSC
2.54 BSC
15.24 BSC
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
36.45
13.72
3.94
0.36
1.02
1.65
0.20
2.92
0°
0.51
37.21
14.22
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0°
0.020
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
15°
0.040
A
B
C
D
F
G
H
J
K
L
M
N
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
114
15
28
B
A
C
N
K
M
J
D
SEATING
PLANE
F
HG
L
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
17.80
7.40
2.35
0.35
0.41
0.23
0.13
0°
10.05
0.25
18.05
7.60
2.65
0.49
0.90
0.32
0.29
8°
10.55
0.75
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0°
0.395
0.010
0.711
0.299
0.104
0.019
0.035
0.013
0.011
8°
0.415
0.029
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
-A-
-B-
114
15
28
-T-
C
SEATING
PLANE
0.010 (0.25)
B
M
M
M
J
-T-
K
26X
G
28X
D
14X
P
R X 45
°
F
0.010 (0.25)
T A
B
M
S
S
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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