1996 Apr 17

3

Philips Semiconductors

Product specification

Band-switching diodes

BA482; BA483; BA484

THERMAL CHARACTERISTICS

Note

1. Device mounted on a FR4 printed-circuit board without metallization pad.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length 10 mm

300

K/W

thermal resistance from junction to ambient

lead length 10 mm; note 1

500

K/W

GRAPHICAL DATA

Fig.2

Forward current as a function of

forward voltage.

handbook, halfpage

0

1.5

100

0

50

MBG304

0.5

1

I F

(mA)

V

(V)

F

(1)

(2)

(3)

Solid line: maximum values.

Dotted line: typical values.

Fig.3

Reverse current as a function of

junction temperature.

handbook, halfpage

10

1

150

0

MBG303

50

100

Tj ( C)

o

I R

(nA)