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ERTEC Fiches technique(PDF) 33 Page - Renesas Technology Corp |
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ERTEC Fiches technique(HTML) 33 Page - Renesas Technology Corp |
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33 / 51 page ![]() 33 Data Sheet A17989EE2V0DS00 µPD800261 2.3 Thermal Characteristics Table 2-3: Thermal Characteristics of Package Parameter Symbol Airflow (m/s) Unit 00.2 1 2 Thermal resistance junction to ambientNote 1 Θja 30 27 23 21 K/W Thermal resistance junction to top center of the package surfaceNote 1 Ψjt 0.2 0.3 0.6 0.8 K/W Thermal resistance top center of the package surface to ambientNote 1 Ψta 29.8 26.7 22.4 20.2 K/W Thermal resistance junction to caseNote 2 Θjc 5.2 5.2 5.2 5.2 K/W Maximum case temperature Tcmax 105 °C Notes: 1. The parameters are valid, if no heat sink is used and a PCB with at least 4 layers and massive ground and power planes. 2. The parameter is valid, if a heat sink is used. |
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