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MPC8280EC Fiches technique(PDF) 77 Page - NXP Semiconductors |
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MPC8280EC Fiches technique(HTML) 77 Page - NXP Semiconductors |
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77 / 83 page ![]() MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2 Freescale Semiconductor 77 Package Description 9.2 Mechanical Dimensions This figure provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU/VV) package. See Table 2, “HiP7 PowerQUICC II Device Packages.” Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA Dim Millimeters Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. 4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls. |
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