| Moteur de recherche de fiches techniques de composants électroniques |
|
ST7LNB0 Fiches technique(PDF) 17 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
ST7LNB0 Fiches technique(HTML) 17 Page - STMicroelectronics |
|
17 / 22 page ![]() ST7LNB0 17/22 7 PACKAGE CHARACTERISTICS 7.1 PACKAGE MECHANICAL DATA Figure 12. 16-Pin Plastic Small Outline Package, 150-mil Width 7.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) TBD °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C Dim. mm inches Min Typ Max Min Typ Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 9.80 10.00 0.386 0.394 E 3.80 4.00 0.150 0.157 e 1.27 0.050 H 5.80 6.20 0.228 0.244 α 0° 8° 0° 8° L 0.40 1.27 0.016 0.050 Number of Pins N 16 0016020 E H A1 C a 45× A1 A B D e 16 9 1 8 L |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |