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ORG4572-R01-TR2 Fiches technique(PDF) 29 Page - List of Unclassifed Manufacturers |
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ORG4572-R01-TR2 Fiches technique(HTML) 29 Page - List of Unclassifed Manufacturers |
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29 / 40 page ![]() Page 29 of 40 Multi Spider - ORG4572 Datasheet Revision 3.0 November 23, 2014 19. RECOMMENDED PCB LAYOUT 19.1. FOOTPRINT FIGURE 13 – FOOTPRINT Ground paddle at the middle should be connected to main Ground plane by multiple vias. Ground paddle at the middle must be solder masked. Silk print of module’s outline is highly recommended for SMT visual inspection. FIGURE 14 – MODULE HOSTED ON FOOTPRINT |
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