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PWD5F60 Fiches technique(PDF) 20 Page - STMicroelectronics |
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PWD5F60 Fiches technique(HTML) 20 Page - STMicroelectronics |
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20 / 26 page ![]() Symbol Dimensions (mm) Min. Typ. Max. D2 1.89 1.99 2.09 D3 5.10 D4 1.70 1.86 1.90 D5 1.945 D6 0.50 0.60 0.70 D7 8.30 D8 2.17 2.27 2.37 D9 0.70 0.80 0.90 D10 0.85 0.95 1.05 D11 2.985 D12 4.01 D13 2.85 D14 0.20 0.345 0.40 E1 0.90 1.00 1.10 E2 1.455 E3 3.13 3.23 3.33 E4 0.505 0.605 0.705 E5 2.75 2.85 2.95 E6 3.70 3.80 3.90 L 0.40 0.50 0.60 e 0.65 R1 0.33 R2 0.20 R3 0.15 aaa 0.10 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 Note: • VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. • Dimensioning and tolerances comply with ASME Y14.5-2009. • All dimensions are in millimetres. • A variable pitch is applied on leads. Please refer to Figure 20. for lead position details. • The leads size is comprehensive of the thickness of the leads finishing material. • Dimensions do not include mold protrusion, not to exceed 0.15 mm. • Package outline does not include eventual metal burr dimensions. PWD5F60 VFQFPN 15 x 7 x 1 mm package information DS12543 - Rev 1 page 20/26 |
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