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STPA003 Fiches technique(PDF) 21 Page - STMicroelectronics |
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STPA003 Fiches technique(HTML) 21 Page - STMicroelectronics |
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21 / 25 page ![]() DS10473 Rev 2 21/25 STPA003 General information 24 5.5 Heat sink definition Assuming we have a maximum dissipated power of 26 W (e.g. in the worst case situation of frequent clipping occurrence), considering Tj max is 150 °C and assuming ambient temperature is 70 °C, the available temperature gap for a correct dissipation is 80 °C. This means the thermal resistance of the system Rth has to be 80 °C/26 W = 3 °C/W. The junction to case thermal resistance is 1 °C/W. So the heat sink thermal resistance should be approximately 2 °C/W. This would avoid any thermal shutdown occurrence even after long-term and full-volume operation. |
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