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LEOAC32PT Fiches technique(PDF) 9 Page - STMicroelectronics |
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LEOAC32PT Fiches technique(HTML) 9 Page - STMicroelectronics |
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9 / 17 page ![]() 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 TSSOP-20 package information Figure 4. TSSOP-20 Mechanical drawing Table 7. TSSOP-20 package mechanical data Symbol Milimeters Inches(1) Min. Typ. Max. Min Typ Max A 1.2 0.047 A1 0.05 0.15 0.002 0.004 0.006 A2 0.8 1 1.05 0.031 0.039 0.041 b 0.19 0.30 0.007 c 0.09 0.20 0.004 D 6.4 6.5 6.6 0.252 0.256 0.260 E 6.2 6.4 6.6 0.244 0.252 0.260 E1 4.3 4.4 4.48 0.169 0.173 0.176 e 0.65 BSC 0.0256 BSC K 0° 8° 0° 8° L 0.45 0.60 0.75 0.018 0.024 0.030 1. Values in inches are converted from mm and rounded to 4 decimal digits. Note: TSSOP: Thin-Shrink Small Outline Package, using golden bonding and Nickel/Palladium/Golden-lead-finishing. LEOAC32 Package information DS13854 - Rev 2 page 9/17 |
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