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AT24C01C Fiches technique(PDF) 34 Page - Microchip Technology |
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AT24C01C Fiches technique(HTML) 34 Page - Microchip Technology |
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34 / 45 page ![]() RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS 0.95 BSC MIN E MAX Contact Pad Length (X5) Contact Pad Width (X5) Y1 X1 1.05 0.60 NOM SILK SCREEN 1 2 5 C E X1 Y1 G C 0 6 . 2 g n i c a p S d a P t c a t n o C Contact Pad to Center Pad (X2) G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-23344 Rev B 5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT] Atmel Legacy Global Package Code TSZ AT24C01C/AT24C02C Packaging Information © 2018 Microchip Technology Inc. Datasheet DS20006111A-page 34 |
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