MPC7410EC datasheet(46/56 Pages) NXP

46 / 56 page

MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

System Design Information

Thermagon Inc.

888-246-9050

4707 Detroit Ave.

Cleveland, OH 44102

Internet: www.thermagon.com

8.8.3 Heat Sink Selection Example

For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:

Tj = Ta + Tr + (θjc + θint + θsa) × Pd

where:

Tj is the die-junction temperature

Ta is the inlet cabinet ambient temperature

Tr is the air temperature rise within the computer cabinet

θjc is the junction-to-case thermal resistance

θint is the adhesive or interface material thermal resistance

sa is the heat sink base-to-ambient thermal resistance

Pd is the power dissipated by the device

During operation the die-junction temperatures (Tj) should be maintained less than the value specified in Table 3.

The temperature of the air cooling the component greatly depends upon the ambient inlet air temperature and the air

temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30°

to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of

the thermal interface material (

θint) is typically about 1°C/W. Assuming a Ta of 30°C, a Tr of 5°C, a CBGA package

jc = 0.03, and a power consumption (Pd) of 5.0 W, the following expression for Tj is obtained:

Die-junction temperature:

Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + θsa) × 5.0 W

For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (

sa) versus airflow velocity is

shown in Figure 30.

Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7°C/W, thus

Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + 7°C/W) × 5.0 W,

resulting in a die-junction temperature of approximately 75°C which is well within the maximum operating

temperature of the component.

Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, and Wakefield

Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow.

MPC7410EC Fiches technique(PDF) 46 Page - NXP Semiconductors