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ADP1031ACPZ-1-R7 Fiches technique(PDF) 37 Page - Analog Devices

No de pièce ADP1031ACPZ-1-R7
Description  Three-Channel, Isolated Micropower Management Unit with Seven Digital Isolators
PDF  38 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADP1031ACPZ-1-R7 Fiches technique(HTML) 37 Page - Analog Devices

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Data Sheet
ADP1031
Rev. A | Page 37 of 38
PCB LAYOUT CONSIDERATIONS
To achieve optimum efficiency, proper regulation, strong
stability, and low noise, a well designed PCB layout is required.
Follow these guidelines when designing PCBs:
Keep the input bypass capacitor, CIN, close to the VINP pin
and the PGNDP pin.
Keep the high current switching paths as short as possible.
These paths include the connections between the
following:
CIN, VINP, the primary winding of the transformer,
and PGNDP
VOUT1, CFLYBK, Diode 1 (D1), the secondary winding
of the transformer, and SGND2
VOUT2, SW2, Inductance 1 (L1), CBUCK, and SGND2
VOUT3, SW3, Inductance 2 (L2), CINV, and SGND2
Keep high current traces as short and wide as possible to
minimize parasitic series inductance, which causes spiking
and EMI.
Avoid routing high impedance traces near any node
connected to the SWP, SW2, and SW3 pins or near the L1
and L2 inductors or the T1 transformer to prevent radiated
switching noise injection.
Place the feedback resistors as close to the FB1 and FB3
pins as possible to prevent high frequency switching noise
injection.
To minimize EMI, place the MVDD decoupling capacitor
(C1) as close to the MVDD pin (Pin 39) and the MGND pin
(Pin 3).
To minimize EMI, place the SVDD1 decoupling capacitor
(C3) as close to the SVDD1 pin (Pin 10) and the SGND1
pin (Pin 5), and place the SVDD2 decoupling capacitor
(C7) as close to the SVDD2 pin (Pin 20) and the SGND2
pin (Pin 16).
Figure 77 shows a suggested top layer layout for the ADP1031.
CIN
C1
CINV
C3
VOUT1
VOUT2
VOUT3
VINP
PGNDP
CBUCK
CFLYBK
18.8mm
U1
T1
D1
C7
R7
R8
R9
R10
L1
L2
MVDD
Figure 77. Suggested Top Layer Layout



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