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MPC5675KFF0VMS2R Fiches technique(PDF) 1 Page - NXP Semiconductors |
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MPC5675KFF0VMS2R Fiches technique(HTML) 1 Page - NXP Semiconductors |
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1 / 147 page  TBD MAPBGA–225 15 mm x 15 mm QFN12 ##_mm_x_##mm SOT-343R ##_mm_x_##mm PKG-TBD ## mm x ## mm 257 MAPBGA (14 x 14 mm) 473 MAPBGA (19 x 19 mm) NXP Semiconductors Data Sheet: Technical Data Document Number: MPC5675K Rev. 9, 12/2021 MPC5675K NXP reserves the right to change the proudction detail specifications as may be required to permit improvements in the design of its products. 1 Introduction 1.1 Document overview This document provides electrical specifications, pin assignments, and package diagrams for the MPC5675K series of microcontroller units (MCUs). 1.2 Description The MPC5675K microcontroller, a SafeAssure solution, is a 32-bit embedded controller designed for advanced driver assistance systems with RADAR, CMOS imaging, LIDAR and ultrasonic sensors, and multiple 3-phase motor control applications as in hybrid electric vehicles (HEV) in automotive and high temperature industrial applications. A member of NXP Semiconductor’s MPC5500/5600 family, it contains the Book E compliant Power Architecture technology core with Variable Length Encoding (VLE). This core complies with the Power Architecture embedded category, and is 100 percent user mode compatible with the original Power PC ™ user instruction set architecture (UISA). It offers system performance up to four times that of its MPC5561 predecessor, while bringing you the reliability and familiarity of the proven Power Architecture technology. A comprehensive suite of hardware and software development tools is available to help simplify and speed system design. Development support is available from leading tools vendors providing compilers, debuggers and simulation development environments. 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.4 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.5 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.6 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . 17 2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 69 3.3 Recommended operating conditions . . . . . . . . . . . . . . 70 3.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 72 3.5 Electromagnetic interference (EMI) characteristics . . . 73 3.6 Electrostatic discharge (ESD) characteristics. . . . . . . . 74 3.7 Static latch-up (LU). . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 3.8 Power Management Controller (PMC) electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 3.9 Supply current characteristics . . . . . . . . . . . . . . . . . . . 76 3.10 Temperature sensor electrical characteristics . . . . . . . 77 3.11 Main oscillator electrical characteristics . . . . . . . . . . . . 77 3.12 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 78 3.13 16 MHz RC oscillator electrical characteristics . . . . . . 79 3.14 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 80 3.15 Flash memory electrical characteristics . . . . . . . . . . . . 85 3.16 SRAM memory electrical characteristics . . . . . . . . . . . 87 3.17 GP pads specifications . . . . . . . . . . . . . . . . . . . . . . . . . 87 3.18 PDI pads specifications . . . . . . . . . . . . . . . . . . . . . . . . 90 3.19 DRAM pad specifications . . . . . . . . . . . . . . . . . . . . . . . 93 3.20 RESET characteristics . . . . . . . . . . . . . . . . . . . . . . . . 100 3.21 Reset sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 3.22 Peripheral timing characteristics. . . . . . . . . . . . . . . . . 107 4 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 4.1 Package mechanical data. . . . . . . . . . . . . . . . . . . . . . 131 5 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 6 Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 7 Document revision historys . . . . . . . . . . . . . . . . . . . . . . . . . 137 MPC5675K Microcontroller Data Sheet |
Numéro de pièce similaire - MPC5675KFF0VMS2R |
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Description similaire - MPC5675KFF0VMS2R |
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