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STM8S103F2 Fiches technique(PDF) 100 Page - STMicroelectronics |
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STM8S103F2 Fiches technique(HTML) 100 Page - STMicroelectronics |
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100 / 121 page ![]() Package information STM8S103F2 STM8S103F3 STM8S103K3 100/121 DocID15441 Rev 14 11.5 TSSOP20 package information Figure 56. TSSOP20 package outline Table 56. TSSOP20 package mechanical data Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 D(2) 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 6.400 6.500 6.600 0.2520 0.2559 0.2598 E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1(3) 4.300 4.400 4.500 0.1693 0.1732 0.1772 e - 0.650 - - 0.0256 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0.0° - 8.0° 0.0° - 8.0° aaa - - 0.100 - - 0.0039 |
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