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STM8L051F3 Fiches technique(PDF) 90 Page - STMicroelectronics |
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STM8L051F3 Fiches technique(HTML) 90 Page - STMicroelectronics |
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90 / 96 page ![]() Package characteristics STM8L051F3 90/96 DS9178 Rev 4 Figure 39. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint 1. Dimensions are expressed in millimeters. 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. YA_FP_V1 7.10 4.40 0.25 0.25 6.25 1.35 0.40 0.65 1.35 1 20 11 10 |
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