ADP165ACPZN-3.3-R7 datasheet(20/23 Pages) AD

20 / 23 page

ADP165/ADP166

Data Sheet

Rev. A | Page 20 of 23

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 55. WLCSP, TA = 85°C

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 56. TSOT, TA = 85°C

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 57. LFCSP, TA = 85°C

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP165/ADP166.

However, as listed in Table 10, a point of diminishing returns is

reached eventually, beyond which an increase in the copper size

does not yield significant heat dissipation benefits.

PCB LAYOUT CONSIDERATIONS

Place the input capacitor as close as possible to the VIN pin and

the GND pin. Place the output capacitor as close as possible to

the VOUT pin and the GND pin. Use of 0402 or 0603 size

capacitors and resistors achieves the smallest possible footprint

solution on boards where area is limited.

Figure 58. Example of 5-Lead TSOT PCB Layout

Figure 59. Example of 4-Ball WLCSP PCB Layout

Figure 60. Example of 6-Lead LFCSP PCB Layout

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