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ADP5075ACBZ-R7 Fiches technique(PDF) 19 Page - Analog Devices |
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ADP5075ACBZ-R7 Fiches technique(HTML) 19 Page - Analog Devices |
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19 / 19 page ![]() Data Sheet ADP5075 Rev. B | Page 19 of 19 OUTLINE DIMENSIONS BOTTOM VIEW (BALL SIDE UP) A B C D 0.660 0.600 0.540 1.65 1.61 1.57 2.22 2.18 2.14 1 2 3 0.360 0.320 0.280 0.50 BSC BALL A1 IDENTIFIER SEATING PLANE 0.270 0.240 0.210 0.390 0.360 0.330 COPLANARITY 0.04 TOP VIEW (BALL SIDE DOWN) END VIEW 0.325 0.305 0.285 0.360 0.340 0.320 Figure 29. 12-Ball Wafer Level Chip Scale Package [WLCSP] (CB-12-11) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADP5075ACBZ-R7 −40°Cto+125°C 12-Ball Wafer Level Chip Scale Package [WLCSP] CB-12-11 ADP5075CB-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. ©2015–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12819-0-9/17(B) |
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