ADP5075ACBZ-R7 datasheet(5/19 Pages) AD

5 / 19 page

Data Sheet

ADP5075

Rev. B | Page 5 of 19

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVIN, AVIN

−0.3 V to +18 V

PVIN − 40 V to PVIN + 0.3 V

GND

−0.3 V to +0.3 V

VREG

−0.3 V to lower of AVIN + 0.3 V or +6 V

EN, FB, SYNC/FREQ

−0.3 V to +6 V

COMP, SLEW, SS, VREF

−0.3 V to VREG + 0.3 V

Operating Junction

Temperature Range

−40°C to +125°C

Storage Temperature

Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is based on a 4-layer printed circuit board (PCB) (two

signals and two power planes) as recommended in the Layout

Considerations section. θJC is measured at the top of the

package and is independent of the PCB.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

12-Ball WLCSP

68.3

1.2

°C/W

ESD CAUTION

ADP5075ACBZ-R7 Fiches technique(PDF) 5 Page - Analog Devices

ADP5075ACBZ-R7 Fiches technique(HTML) 5 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Fiches technique Télécharger

Lien URL