ADP5074ACPZ-R7 datasheet(5/17 Pages) AD

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Data Sheet

ADP5074

Rev. A | Page 5 of 17

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVIN, AVIN

−0.3 V to +18 V

PVIN − 40 V to PVIN + 0.3 V

GND

−0.3 V to +0.3 V

VREG

−0.3 V to lower of AVIN + 0.3 V or +6 V

EN, FB, SYNC/FREQ, PWRGD

−0.3 V to +6 V

COMP, SLEW, SS, VREF

−0.3 V to VREG + 0.3 V

Operating Junction

Temperature Range

−40°C to +125°C

Storage Temperature

Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA and ΨJT are based on a 4-layer printed circuit board (PCB)

(two signals and two power planes) with thermal vias connecting

the exposed pad to a ground plane as recommended in the

Layout Considerations section. θJC is measured at the top of the

package and is independent of the PCB. The ΨJT value is more

appropriate for calculating junction to case temperature in the

application.

Table 4. Thermal Resistance

Package Type

θJA

θJC

ΨJT

Unit

16-Lead LFCSP

75.01

55.79

0.95

°C/W

ESD CAUTION

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