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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC8560CPX667JC Fiches technique(PDF) 70 Page - NXP Semiconductors |
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MPC8560CPX667JC Fiches technique(HTML) 70 Page - NXP Semiconductors |
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70 / 108 page  MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2 70 Freescale Semiconductor Package and Pin Listings 14 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. 14.1 Package Parameters for the MPC8560 FC-PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 flip chip plastic ball grid array (FC-PBGA). Die size 12.2 mm × 9.5 mm Package outline 29 mm × 29 mm Interconnects 783 Pitch 1 mm Minimum module height 3.07 mm Maximum module height 3.75 mm Solder Balls 62 Sn/36 Pb/2 Ag Ball diameter (typical) 0.5 mm |
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