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ML2213 Fiches technique(PDF) 25 Page - OKI electronic componets |
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ML2213 Fiches technique(HTML) 25 Page - OKI electronic componets |
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25 / 26 page ![]() FEDL 2213-01 1Semiconductor ML2213 25/26 SSOP14-P-44-0.65-K Mirror Finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating ( ≥5µm) Package weight (g) 0.066 TYP. 5 Rev. No./Last Revised 1/Sept. 18, 1998 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm) |
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