LT8338

19

Rev. 0

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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog

Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

MSOP (MSE) 0213 REV I

0.53

±0.152

(.021

±.006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 –0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

1 2 3 4 5

4.90

±0.152

(.193

±.006)

0.497

±0.076

(.0196

±.003)

REF

8

9

10

10

1

7 6

3.00

±0.102

(.118

±.004)

(NOTE 3)

3.00

±0.102

(.118

±.004)

(NOTE 4)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD

SHALL NOT EXCEED 0.254mm (.010") PER SIDE.

0.254

(.010)

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.10

(.201)

MIN

3.20 – 3.45

(.126 – .136)

0.889

±0.127

(.035

±.005)

RECOMMENDED SOLDER PAD LAYOUT

1.68

±0.102

(.066

±.004)

1.88

±0.102

(.074

±.004)

0.50

(.0197)

BSC

0.305

± 0.038

(.0120

±.0015)

TYP

BOTTOM VIEW OF

EXPOSED PAD OPTION

1.68

(.066)

1.88

(.074)

0.1016

±0.0508

(.004

±.002)

DETAIL “B”

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.05 REF

0.29

REF

MSE Package

10-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1664 Rev I)