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Moteur de recherche de fiches techniques de composants électroniques |
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MCH032FN103CK Fiches technique(PDF) 5 Page - Rohm |
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MCH032FN103CK Fiches technique(HTML) 5 Page - Rohm |
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5 / 13 page  MCH03 Ceramic capacitors Rev.A 5/12 Resistance to solderin heat As per 4.14 of JIS C 5101-1. As per 4.10 of JIS C 5101-10 The solder specified in JIS Z 3282. H63A shall be used. The specimens shall be immersed into the solder at 260 +/−5°C for 5+/−0.5s so that both end terminations are completely under the solder. Pre-heating at 150 +/−10°C for 1 to 2min Initial measurements prior to test shall be performed after the thermal Pre-conditioning specified in Remarks (1). Final measurements shall be made after the specimens have been left at room temperature as per Table3. As per 4.13 of JIS C 5101-1. As per 4.8 ofJIS C 5101-10 A 2N weight for 10 +/−1s shall be applied to the soldered specimens as shown by the arrow mark in the below sketch. 8 End termination adherence 9 C N F N Within +/−2.5% or +/−0.25pF whichever is larger. Within +/−7.5% Within +/−20% Appearance Dielectric loss tangent Within specified initial value. Insulation resistance Within specified initial value. Withstanding voltage No defects shall be allowed. Without peeling or sign of peeling shall be allowed on the end terminations. Change rate from initial value Without mechanical damage. Table3 24 +/−2 h 48 +/−4 h Charac- teristic Time A, AN CN, FN Applied pressure Capacitor Substrate Items Performance Test Method (As per JIS C 5101-1, JIS C 5101-10) As per 4.24 of JIS C 5101-1. As per 4.7 of JIS C 5101-10 Temperature coefficient shall be calculated at 20 °C and 85°C. As per 4.24 of JIS C 5101-1. As per 4.7 of JIS C 5101-10 If required, measurements shall be made at a given temperature. As per 4.15.2 of JIS C 5101-1. As per 4.11 of JIS C 5101-10 The solder specified in JIS Z 3282 H63A shall be used. Ans the flux containing 25% rosin and ethanol solution shall be used. The specimens shall be immersed into the solder at 235 +/−5°C for 2+/−0.5s So that both end terminations are completely under solder. No. Temperature characteristic More than 3/4 of each end termination shall be covered with new solder. 6 Solderability 7 C N F N Capacitance C 2pF 0 +/−250ppm/°C Capacitance C=3pF 0 +/−120ppm/°C Capacitance C 4pF 0 +/−60ppm/°C ( −55°C to +125°C) +/−15% ( −55°C to +125°C) +30%, −80% ( −25°C to +85°C) +22%, −82% ( −30°C to +85°C) +/−10% ( −25°C to +85°C) +/−15% ( −55°C to +85°C) X7R R X5R B A, AN A, AN < − < − |
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