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ATMEGA640 Fiches technique(PDF) 4 Page - Microchip Technology |
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ATMEGA640 Fiches technique(HTML) 4 Page - Microchip Technology |
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4 / 436 page ![]() 4 ATmega640/V-1280/V-1281/V-2560/V-2561/V [DATASHEET] DS40002211A Figure 1-3. Pinout ATmega1281/2561 Note: The large center pad underneath the QFN/MLF package is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the pack- age might loosen from the board. (RXD0/PCINT8/PDI) PE0 (TXD0/PDO) PE1 (XCK0/AIN0) PE2 (OC3A/AIN1) PE3 (OC3B/INT4) PE4 (OC3C/INT5) PE5 (T3/INT6) PE6 (ICP3/CLKO/INT7) PE7 (SS/PCINT0) PB0 (OC0B) PG5 (SCK/ PCINT1) PB1 (MOSI/ PCINT2) PB2 (MISO/ PCINT3) PB3 (OC2A/ PCINT4) PB4 (OC1A/PCINT5) PB5 (OC1B/PCINT6) PB6 PA3 (AD3) PA4 (AD4) PA5 (AD5) PA6 (AD6) PA7 (AD7) PG2 (ALE) PC7 (A15) PC6 (A14) PC5 (A13) PC4 (A12) PC3 (A11) PC2 (A10) PC1 (A9) PC0 (A8) PG1 (RD) PG0 (WR) INDEX CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 |
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